Tekdis Products

ICES 668

Category: COM EXPRESS

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CPU Support

Support Intel® BGA 1023, 3rd generation Intel® Core™ processor
- Intel® Core™ i7 3615QE (4C/ 6M cache/ 2.3GHz/ Max. TDP 45W)
- Intel® Core™ i7 3555LE (2C/ 4M cache/ 2.5GHz/ Max. TDP 25W)
- Intel® Core™ i7 3517UE (2C/ 4M cache/ 1.7GHz/ Max. TDP 17W)
- Intel® Core™ i3 3217UE (2C/ 3M cache/ 1.6GHz/ Max. TDP 17W)
- Intel® Core™ i5 3610ME (2C/ 3M cache/ 2.7GHz/ Max. TDP 35W)

Main Memory

Dual DDR3/ SO-DIMMs, support 1333/1600MHz ECC system memory up to 16GB

Platform Control Hub

Intel® QM77 PCH chipset

BIOS

AMI System UEFI BIOS Plug and play support Advanced power management and advanced configuration & power interface support

Display

Intel® HD graphics with DX11 support up to triple independent displays One PCI Express x16 Lane down to the carried board Supports VGA and single/dual channel s 18/24 bit LVDS interface 3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and SVDO interfaces

Audio

HD audio interface

On-board LAN

Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 Support PXE boot from LAN, wake on LAN function Signals down to I/O board

COM Express Connector

AB
VGA/ LVDS/ 8x USB 2.0 /

2x Serial Port / HD Audio/

4x SATA/ GbE/ GPIO/ LPC bus,

1x PCIe X4

3x PCIe

X1 SMBus (I2C)/ SPI BIOS /SPK out CD
PCIe x16

3x DDI

4x USB 3.0

Power Requirements

+12V, +5VSB, +3.3V RTC power

Dimensions

95mm (W) x 125mm (L)

Environment

Board level operating temperatures: 0°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)

Certifications

Meet CE FCC Class A

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