Tekdis Products

ICES667

Category: COM EXPRESS

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CPU Support

Support 3rd generation Intel® Core™ i7/ i5/ i3 embedded rPGA988 processors

– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)

– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)

– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)

Main Memory

Two DDR3 SO-DIMMs, 1333/ 1600 MHz SDRAM non-ECC up to 16GB

Platform Control Hub

Intel® QM77 PCH (option HM76) chipset

BIOS

AMI UEFI System BIOS Plug and play support Advanced Power Management and ACPI support

Display

Intel® HD graphics with DX11 support and supports Triple independent displays displays One PCI Express x 16 Lane (Gen. 3.0) down to the carried board Supports VGA, single/ dual channels LVDS 18/ 24-bit interfaces 3x DDI supports HDMI, DVI, DisplayPort and SDVO ( only by Port B/ DDI #1)

Audio

HD audio interface

On-board LAN

Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with QM77 only) Support boot from LAN, wake on LAN function Signals down to I/O board

COM Express Connector

AB
VGA/ LVDS

8x USB 2.0, HD Audio

4x SATA2.03.0, GbE/ GPIO/ LPC bus,

1x PCIe x4

2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out CD
PCIe x16(Gen. 3.0)/

3x DDI/

4x USB 3.0

PCIe x1

Power Requirements

+12V, +5VSB, +3.3V RTC power

Dimensions

95mm (W) x 125mm (L)

Environment

Board level operating temperature: -15°C to 60°C Storage temperature: -20°C to 80°C Relative humidity:

10% to 90% (operating, non-condensing)

5% to 95% (non-operating, non-condensing)

Certifications

Meet CE FCC Class A

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