Tekdis Products

ICES 670

Category: COM EXPRESS

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CPU Support

Support Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/ Shark Bay-MB)

Main Memory

Dual ECC-DDR3L/ SO-DIMMs, support 1333/1600MHz memory up to 16GB

Platform Control Hub

Intel® 8 series (Lynx Point-M) PCH chipset

BIOS

AMI System UEFI BIOS Plug and play support Advanced power management and advanced configuration & power interface support

Audio

HD audio interface

On-board LAN

Intel® Clarkville(I217) Gigabit Ethernet, support next generation vPro/iAMT Support PXE boot from LAN, wake on LAN function Signals down to I/O board

COM Express Connector

AB

VGA/ LVDS/ 8x USB2.0 / HD Audio/ 4x SATA/ GbE/ GPIO/ LPC bus,1x PCIe x4/ 3x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out CD

PCIex16/ 3x DDI /4x USB 3.0

Power Requirements

+12V, +5VSB, +3.3V RTC power

Dimensions

95mm (W) x 125mm (L)

Environment

Board level operating temperatures: -15°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity:

10% to 90% (operating, non-condensing)

5% to 95% (non-operating, non-condensing)

Certifications

Meet CE FCC Class A

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