AV600-THT Military IP66 Mission GPU Computer
MIL-STD 810 Thermal, shock, vibration, Humidity/EMI/EMC conditions, IP66 Chassis with D38999 connectors
Key Features:
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
- Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
- Soldered 64 GB NVMe
- IP65 2 x 2.5” SATA SSD Easy Swap Tray
- MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to 70°C
- Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
The AV600X-THT is powered by Intel® 11th Gen Tiger Lake-H Processors, featuring integrated Intel® UHD Graphics (Xe architecture). The Tiger Lake H processor is constructed using advanced 10nm SuperFin Technology and boasts up to 8 CPU cores with a clock frequency of 4.7 GHz. This results in exceptional computing performance and adaptability for demanding IoT workloads. Notably, this platform exhibits substantial performance improvements compared to previous generations, with up to a 32 percent increase in single-thread performance. Additionally, it offers high-bandwidth, high-speed I/O capabilities for expansion and peripheral connectivity.
The AV600X-THT stands out with its robust design and impressive functionality. The system is equipped with MIL-STD Amphenol type connectors and features full IP66 protection, making it capable of withstanding harsh environmental conditions. Furthermore, the AV600X-THT supports an extended temperature range from -40°C to 70°C and operates with a MIL-STD-461 compliant 18V to 36V DC-input power supply. This not only safeguards the system from voltage surges but also enhances the reliability of its critical components and the system as a whole.
Key Features:
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MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
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IP66 Chassis with D38999 connectors
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Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
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Up to 96GB DDR4 SO-DIMM, non-ECC and ECC
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NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
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Soldered 64 GB NVMe
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IP65 2 x 2.5” SATA SSD Easy Swap Tray
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MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
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Extreme Temperature : -40°C to 70°C
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Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
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System |
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CPU |
Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics Intel® Xeon® W-11865MRE, 45W Tiger Lake 11th Gen, 8C, Freq. 2.6/4.7 GHz, 24MB cache |
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Memory type |
Up to 96GB DDR4 SO-DIMM, non-ECC and ECC |
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CHIPSET |
Intel® RM590E (support ECC, with Xeon CPU) /QM580E |
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GPU |
NVIDIA RTX™ A4500 GA104-955 GPU 8GB/16GB GDDR6 memory, 5888 CUDA cores |
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On Board Storage |
Soldered 64 GB NVMe |
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Expansion Slot |
2x Full-size mini PCIe (1 with mSATA supported) -1 with mSATA/USB2.0/PCIeX1 support -1 with SIM/USB2.0/PCIeX1 support 1x 2280 M key (SATA only) |
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Storage |
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SATA |
2x 2.5” SSD, Hot Swappable SSD/HDD slot |
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M.2 |
1x 2280 M key (SATA only) |
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Front I/O |
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X1 |
2x GbE LAN + 2x USB2.0 + 1x COM(RS232) with D38999 connector |
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X2 |
1x VGA + 4x DI/4x DO + 3x RS422 with D38999 connector |
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X3 |
1x USB3.0 , with D38999 connector |
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X4 |
1x USB3.0 , with D38999 connector |
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X5 |
1x DC-in, with D38999 connector |
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LED |
1x SSD/HDD LED indicator |
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switch |
1x IP65 power button, with LED indicator |
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SSD |
2x 2.5” Easy swap SSD Tray |
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Power |
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Power input |
MIL-STD-461 18V~36V DC-Input |
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Application, Operating System |
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Application |
Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. |
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Operating System |
Windows® 10 64-bit / Linux (support by request) |
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Physical |
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Dimension |
250(L) x 325 (W) x 100 (H)mm |
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Weight |
11 KG |
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Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20°C to 55°C |
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Storage Temp. |
-40°C to 85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 |
Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
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Reliability |
No Moving Parts; Passive Cooling. Designed and manufactured using ISO 9001 / 2000 Certified Quality Program. |
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MIL-STD-461 |
CE102 : 10 KHz - 10 MHz RE102-4 : 1.5 MHz -30 MHz - 5 GHz RS103: 200 MHz - 3.0 GHz - 5.0 GHz, 50 V/m equal for all frequencies |
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Designed to Meet Items ( Options ) |
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CS101, CS114, CS115, CS116 |
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CE106, RE103, RS101 |
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MIL-STD-1275 |
Steady State |
20V-33V |
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Surge Low |
18V/500ms |
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Surge High |
100V/500ms |
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