DRPC-240-TGL-U Fanless DIN-Rail 11th Gen CPU

In stock
SKU:
DRPC-240-TGL-U-xxCS-R11

Fanless DIN-Rail Embedded System Tiger Lake Intel 11th Gen Solution

Key Features:

  • Supported CPU:
    • Intel Celeron 6305/6305E 1.8 GHz (dual-core, 15W TDP)
    • Intel Core i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, 15W TDP)
    • Intel Core i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, 15W TDP)
  • 4 x 2.5GbE ports, supporting PoE (optional)
  • 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
  • CE/FCC compliant

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Powerful yet Compact
High-Performance Fanless Modular DIN-Rail PC

The DRPC-240 is a modular embedded computer for flexible configuration according to specific usage requirements and is designed for performance-intensive and space-critical applications. Moreover, the fanless DIN-rail PC-mounted 11th Gen Intel® Core mobile processor with 8GB of pre-installed memory and Intel iRIS® Xe graphics delivers great performance.

This device's modular configuration enables users to insert an AI accelerator card or add-on card via a PCIe x4 slot, thus improving edge computation results. In addition, the DRPC-240 can operate in a wide range of temperatures, from -20 to 60 degrees Celsius (-4 to 140 degrees Fahrenheit), and meets IEEE802.3af standard with quad 2.5GbE ports and 15W power output per port at a distance of 100 meters. This makes it ideal for use in factory automation, warehouse management, transportation, and other robust operational environments.

 

11th Gen. Intel® Core™ Processors Optimize AI Inference and Machine Vision Applications

The DRPC-240 is powered by 11th Gen Intel® Core™ i7/i5 and Intel® Celeron® processors for blazing fast performance. The 11th Gen Intel® Core™ processor is up to 23% faster in single-thread performance and up to 19% faster in multi-thread performance than its prior generation for smoother handling of intensive computing tasks. Intel® iRIS® Xe graphics is integrated to offer great GPU computing capability with up to 96EUs and 2.95 times faster graphics performance. IEI’s DRPC-240 delivers high computing performance to machine vision and AI applications.

 

Stackable, Modular PCIe x4 Design for Added Functionality

Adding an optional second stack expansion kit, TXC-DRPC-240-1S-R10 enables the DRPC-240 to have flexible functionality for installing a variety of PCIe x4 add-on cards, such as high-density I/O cards, vision cards, motion cards and AI accelerators, according to specific application requirements via simple and reliable board-to-board connections.

 

Versatile, Space-Saving Design for Installation Flexibility

IEI DRPC-240 measures just 19 x 15 x 8 cm, so it takes up very little room to help you maintain a clutter-free workspace. Its DIN-rail mounting support enables the system to be used across space-critical industries and workplace environments. With compact size and rubber foot pads provided, the DRPC-240 is also perfect for set-top box use.

 

Industrial-grade Hardened Hardware Design with 12V~28V DC Wide-range Power Input

Ruggedized hardware architecture safeguards the small-factor computer in harsh, remote and dynamic environments.

» Fanless cooling eliminates failure points

» -20°C to 60°C wide operating temperature

» 15G non-operation and 5G operation shock

» Wide 12V to 28V DC voltage input

» Intel® Platform Trust Technology (Intel® PTT) to enable password protection, device authentication and future-ready cybersecurity

 

Fanless System with Reliable Thermal Design

The DRPC-W-TGL is built with multiple wireless connectivity options necessary for remote and mobile deployments, which include Bluetooth, WiFi and 4G/LTE that enable connections with a variety of industrial IoT devices.
*Wireless M.2 modules are optional

 

-20°C ~ 60°C Wide Operating Temperature, Shock and Vibration Resistance

The DRPC-W-TGL fanless embedded system features a ruggedized chassis that endures strict testing and validation assurance to ensure mission-critical reliability in the most complex edge IoT computing applications. The series has garnered various safety certifications, including CE, FCC and CB, and can therefore be marketed in countries that observe strict EMC and safety standards.

 

Fanless System with Efficient Thermal Design

The DRPC-240's thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two-dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is thus reduced by 35%, significantly enhancing system reliability in vibration-sensitive applications, such as AGV. Moreover, this innovative thermal design allows the DRPC-240 to maximize superior performance compared to those with traditional plate heatsinks consisting of parallel fins.

 

 

 


This product is listed in Embedded Computers, IEI Integration Corp.

Hardware Spec.

 

Form Factor
SBC Form Factor
  • Supported CPU:
    Intel® Celeron® 6305E 1.8 GHz (dual-core, TDP 15W)
    Intel® Core™ i5-1145G7E 1.5 GHz (up to 4.1 GHz, quad-core, TDP 15W)
    Intel® Core™ i7-1185G7E 1.8 GHz (up to 4.4 GHz, quad-core, TDP 15W)
  • Chipset:
    SoC
  • System Memory:
    2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
  • Power:
    Input: Terminal block: 12 ~ 28V DC
  • Consumption: 12V @ 6.98A (Intel® Core™ i5-1145G7E with 8GB memory)
I/O Interface
I/O Ports
  •  USB:
    2 x USB 3.2 Gen 2
    2 x USB 2.0
  • Ethernet: 4 x RJ-45 (* Support optional PoE af module)
    1 x 2.5 GbE by Intel® I226LM
    3 x 2.5 GbE by Intel® I226V (colay I226LM)
  • COM Port:
    2 x RS-422/485 with AFC (DB-9, with 2.5kV isolation)
    2 x RS-232 (DB-9, with 2.5kV isolation)
  • Digital I/O:
    12-bit Digital I/O (6-in/ 6-out) (optional)
  • Display:
    1 x HDMI™ (up to 3840 x 2160@30Hz)
    1 x DP++ (up to 4096 x 2304@60Hz)
  • TPM:
    Support Intel PTT
  • Watchdog Timer:
    Programmable 1 ~ 255 sec/min
Expansion Slots
Expansion Slots
  • M.2:
    1 x 2230 A-key (PCIe Gen3 x1/USB 2.0)
    1 x 3042/52/80 B-key (PCIe Gen3 x1/USB 3.0/USB 2.0)
    1 x On-board SIM card socket (hinge type) for M.2 B key

  • Backplane:
    1 x PCIe x4
    (optional)
System
Cooling method / System Fan Fanless
4-pin external system fan connector
Drive Bays 1 x 2.5” SATA 6Gb/s HDD/SSD bay
Indicator&Buttons
Buttons 1 x Power button
1 x Reset button
1 x AT/ATX switch
Indicators 1 x Power LED (green)
1 x HDD LED (yellow)
Physical Characteristics
Construction Extruded aluminum alloy
Colour
Colour Black
Dimensions
Dimensions 81 x 150 x 190 (mm)
Weight
Weight 2.15/ 2.5 kg
Environment
Operating Temperature -20°C ~ 60°C with air flow (SSD)
Humidity 10% ~ 95% non-condensing
Operating Vibration Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating Shock MIL-STD-810G 514.6C-1 (SSD)
Safety & EMC CE/FCC compliant
OS Support
OS Support Microsoft Windows 10 / Windows 11, Linux

 

 

 

Ordering Information

 

DRPC-240-TGL-U-i7CS-R11

Fanless embedded system, Intel®Tiger Lake-U i7-1185G7E 1.8GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN, 4 x COM, DIO, 12~28V DC and RoHS

DRPC-240-TGL-U-i5CS-R11

Fanless embedded system, Intel®Tiger Lake-U i5-1145G7E 1.5GHz (quad core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN, 4 x COM, DIO, 12~28V DC and RoHS

DRPC-240-TGL-U-W10E64-V-R10

OS Image with Windows® 10 Enterprise Value 64-bit 2019 for DRPC-240-TGL-U Celeron/i3/i5 Series, with DVD-ROM, RoHS

DRPC-240-TGL-U-W10E64-H-R10

OS Image with Windows® 10 Enterprise High End 64-bit 2019 for DRPC-240-TGL-U i7 Series, with DVD-ROM, RoHS

DRPC-240-TGL-U-CECS-R11

Fanless embedded system, Intel®Tiger Lake-U Celeron® 6305E 1.8GHz (dual core, TDP 15W), 8GB DDR4 pre-installed memory, HDMI/DP++, 4 x 2.5GbE LAN, 4 x COM, DIO, 12~28V DC and RoHS

 

 

Package Contents

 

Package Content

  • 1 x DIN-rail mounting kit

  • 1 x Screw pack

  • 1 x SATA cable with power cable