DRPC-W-TGL Fanless DIN-Rail Embedded PC 11th Gen

High-Value Fanless DIN-Rail Embedded System

IEI DRPC-W series are compact, DIN-rail mounted embedded systems designed for IEI 3.5" single board computers. Its compact dimensions are appropriate for applications installed with limited space but require multiple I/O connectivity and enhanced performance. IEI DRPC-W series are designed to handle communication on the factory floor for IoT gateway, motion and vision applications.

Optimized for Improved Efficiency and Performance with Intel® Celeron® Quad Core N5105 Processor

Designed with 11th Generation Intel® Core™/Celeron® processor and Intel® UHD graphics, the DRPC-W-TGL fanless embedded system offers both excellent performance and energy efficiency. With up to 4 cores and 4.40 GHz max turbo frequency, the Intel® Core™ processor acts as the heart of the DRPC-W-TGL fanless embedded system and offers 2 times performance improvement over the predecessor Whiskey Lake.

Optimized Size Saves Cabinet Space

Based on IEI’s industrial-grade 3.5” embedded systems, the DRPC -W series are compact without sacrificing the flexibility in I/O expansion that is often required for IoT scalable sensor connectivity. Moreover, the front-side I/O design is easy for in-cabinet installation.

Time-to-Market Customization

The DRPC-W series’ enclosure is designed for 3.5" single-board computers. With customizable I/O plates, the DRPC-W series allows customization to satisfy various requirements by using IEI's extensive 3.5" SBCs, and WAFER series, offering diverse platform options from low-power to extreme performance. This helps ensure an efficient and quick integration of customers' applications.
*Customized by project base

Easy Assembling & Maintenance

With an easy-to-open bottom cover, the DRPC-W series can deliver the advantages of quick maintenance and Configure-to-Order Service (CTOS) for customers to reduce potential time to market and cost consumption.

• Fast assembly for all accessories
• Simple steps to open enclosure for maintenance, such as M.2, HDD, memory modules
• Accelerate system integrator's local configure-to-order assembly service for end customers

Scalable Wireless Communication Enables Remote Deployments

The DRPC-W-TGL is built with multiple wireless connectivity options necessary for remote and mobile deployments, which include Bluetooth, WiFi and 4G/LTE that enable connections with a variety of industrial IoT devices.
*Wireless M.2 modules are optional

-20°C ~ 60°C Wide Operating Temperature, Shock and Vibration Resistance

The DRPC-W-TGL fanless embedded system features a ruggedized chassis that endures strict testing and validation assurance to ensure mission-critical reliability in the most complex edge IoT computing applications. The series has garnered various safety certifications, including CE, FCC and CB, and can therefore be marketed in countries that observe strict EMC and safety standards.

Fanless System with Efficient Thermal Design

The DRPC-W-TGL thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two-dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is also reduced by 35%. Moreover, the reduced weight enhances system reliability in vibration-sensitive applications, such as AGV, making the DRPC-W-TGL have vastly superior performance to the traditional plate-fin heat sink with continuous parallel fins.

Advanced High-efficiency Fan Kit Releases Extreme Computing Power

For computing-intensive applications, users could opt to add an external fan for an active cooling solution maintaining high system performance in high-temperature environments. This design also brings high reliability by preventing dust or particles from getting into the hardware, and it is easy to disassemble and clean.